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"Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic ..."

Pushparajah Rajaguru et al. (2024)

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DOI: 10.1109/ACCESS.2023.3342689

access: open

type: Journal Article

metadata version: 2024-03-16

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  - https://dblp.org/rec/journals/access/RajaguruT0S24
Pushparajah Rajaguru, Tim Tilford, Chris Bailey, Stoyan Stoyanov:
Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module. IEEE Access 12: 25215-25227 (2024)

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