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Stoyan Stoyanov
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2020 – today
- 2024
- [j19]Pushparajah Rajaguru, Tim Tilford, Chris Bailey
, Stoyan Stoyanov:
Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module. IEEE Access 12: 25215-25227 (2024) - [j18]Mohammad Qasem
, Stoyan Stoyanov
, Sadam Ratrout
, Mariana Haddadin
, Yazan Yassin
, Chengxiu Chen, Said Al-Hallaj, Mahesh Krishnamurthy
:
Synthetic Data-Integrated Li-Ion Battery Modeling for eVTOL Energy Systems. IEEE Access 12: 76329-76343 (2024) - [j17]A. Razia Sulthana, Tim Tilford
, Stoyan Stoyanov
:
Fine-grained food image classification and recipe extraction using a customized deep neural network and NLP. Comput. Biol. Medicine 175: 108528 (2024) - 2023
- [j16]Stoyan Stoyanov
, Chris Bailey
:
Modeling Insights Into the Assembly Challenges of Focal Plane Arrays. IEEE Access 11: 35207-35219 (2023) - 2020
- [j15]Mominul Ahsan
, Stoyan Stoyanov
, Chris Bailey
, Alhussein Albarbar
:
Developing Computational Intelligence for Smart Qualification Testing of Electronic Products. IEEE Access 8: 16922-16933 (2020)
2010 – 2019
- 2019
- [j14]Ana Elsa Hinojosa Herrera, Stoyan Stoyanov, Chris Bailey, Chris Walshaw, Chunyan Yin:
Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Comput. Sci. 9(1): 200 (2019) - [j13]Stoyan Stoyanov
, Mominul Ahsan, Chris Bailey
, Tracy Wotherspoon, Craig Hunt:
Predictive analytics methodology for smart qualification testing of electronic components. J. Intell. Manuf. 30(3): 1497-1514 (2019) - 2018
- [j12]Tim Tilford
, Stoyan Stoyanov
, Jessica B. S. Langbaum, Jan Christoph Janhsen, Matthias Burgard, Richard B. Buxton, Chris Bailey
:
Design, manufacture and test for reliable 3D printed electronics packaging. Microelectron. Reliab. 85: 109-117 (2018) - 2016
- [j11]Giuliano Di Canio, Stoyan Stoyanov, Jørgen Christian Larsen
, John Hallam, Alexandr Kovalev, T. Kleinteich, Stanislav N. Gorb, Poramate Manoonpong
:
A robot leg with compliant tarsus and its neural control for efficient and adaptive locomotion on complex terrains. Artif. Life Robotics 21(3): 274-281 (2016) - [j10]Stoyan Stoyanov
, Chris Bailey
, Georgios Tourloukis:
Similarity approach for reducing qualification tests of electronic components. Microelectron. Reliab. 67: 111-119 (2016) - [c2]Giuliano Di Canio, Stoyan Stoyanov, Ignacio Torroba Balmori, Jørgen Christian Larsen
, Poramate Manoonpong
:
Adaptive Combinatorial Neural Control for Robust Locomotion of a Biped Robot. SAB 2016: 317-328 - 2015
- [j9]Krastyu Georgiev, Young Shin Kim
, Stoyan Stoyanov:
Periodic portfolio revision with transaction costs. Math. Methods Oper. Res. 81(3): 337-359 (2015) - [j8]Chunyan Yin, Chris Best, Chris Bailey
, Stoyan Stoyanov
:
Statistical analysis of the impact of refinishing process on leaded components. Microelectron. Reliab. 55(2): 424-431 (2015) - [j7]Stoyan Stoyanov
, Chris Bailey
:
Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectron. Reliab. 55(9-10): 1271-1279 (2015) - 2014
- [c1]Arjuna Sathiaseelan, Mohamed Said Seddiki, Stoyan Stoyanov, Dirk Trossen:
Social SDN: online social networks integration in wireless network provisioning. SIGCOMM 2014: 375-376 - 2013
- [j6]Stoyan Stoyanov
, Chris Bailey
, M. O. Alam, Chunyan Yin, Chris Best, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott:
Modelling methodology for thermal analysis of hot solder dip process. Microelectron. Reliab. 53(8): 1055-1067 (2013) - 2012
- [j5]Thamo Sutharssan
, Stoyan Stoyanov
, Chris Bailey
, Yasmine Z. Rosunally:
Prognostics and Health Monitoring of High Power LED. Micromachines 3(1): 78-100 (2012) - 2011
- [j4]Xiangdong Xue, Chris Bailey
, Hua Lu, Stoyan Stoyanov
:
Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectron. Reliab. 51(5): 936-945 (2011) - [j3]Yasmine Z. Rosunally, Stoyan Stoyanov
, Chris Bailey
, Peter Mason, Sheelagh Campbell, George Monger, Ian Bell:
Fusion Approach for Prognostics Framework of Heritage Structure. IEEE Trans. Reliab. 60(1): 3-13 (2011)
2000 – 2009
- 2007
- [j2]Stoyan Stoyanov
, Robert W. Kay
, Chris Bailey, Marc P. Y. Desmulliez
:
Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives. Microelectron. Reliab. 47(1): 132-141 (2007) - 2002
- [j1]Hua Lu, K. C. Hung, Stoyan Stoyanov
, Chris Bailey
, Y. C. Chan:
No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectron. Reliab. 42(8): 1205-1212 (2002)
Coauthor Index
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last updated on 2024-08-05 20:22 CEST by the dblp team
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