"Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked ..."

Tong Yan Tee et al. (2003)

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DOI: 10.1142/S1465876303001241

access: closed

type: Journal Article

metadata version: 2020-07-09

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Tong Yan Tee, Giovanni Frezza, Mayhuan Lim, Hun Shen Ng, Federico Ziglioli, Zhaowei Zhong:
Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn. Int. J. Comput. Eng. Sci. 4(2): 347-350 (2003)

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