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ORCIDTong Yan Tee
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2010 – 2019
- 2010
[j11]Tong Yan Tee, Xuejun Fan
, Yi-Shao Lai:
Advances in Wafer Level Packaging (WLP). Microelectron. Reliab. 50(4): 479-480 (2010)- [j10]Ahmer Syed, Tong Yan Tee, Hun Shen Ng, Rex Anderson, Choong Peng Khoo, Boyd Rogers:
Advanced analysis on board trace reliability of WLCSP under drop impact. Microelectron. Reliab. 50(7): 928-936 (2010)
2000 – 2009
- 2007
- [j9]Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong:
Dynamic responses and solder joint reliability under board level drop test. Microelectron. Reliab. 47(2-3): 450-460 (2007) - 2006
- [j8]Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong:
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA. Microelectron. Reliab. 46(12): 2131-2138 (2006) - 2004
- [j7]Tong Yan Tee, Zhaowei Zhong:
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis. Microelectron. Reliab. 44(1): 105-114 (2004) - [j6]Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong:
Impact life prediction modeling of TFBGA packages under board level drop test. Microelectron. Reliab. 44(7): 1131-1142 (2004) - [j5]Tong Yan Tee, Zhaowei Zhong:
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages. Microelectron. Reliab. 44(12): 1957-1965 (2004) - 2003
- [j4]Tong Yan Tee, Giovanni Frezza, Mayhuan Lim, Hun Shen Ng, Federico Ziglioli, Zhaowei Zhong:
Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn. Int. J. Comput. Eng. Sci. 4(2): 347-350 (2003) - [j3]Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong:
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. Microelectron. Reliab. 43(5): 741-749 (2003) - [j2]Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong:
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications. Microelectron. Reliab. 43(7): 1117-1123 (2003) - [j1]Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong:
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages. Microelectron. Reliab. 43(8): 1329-1338 (2003)
Coauthor Index
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