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ORCID"3-D Silicon Integration and Silicon Packaging Technology Using Silicon ..."
John U. Knickerbocker et al. (2006)
- John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte:
3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. IEEE J. Solid State Circuits 41(8): 1718-1725 (2006)
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