"Co-Design of Interchiplet, Package, and System Interconnect Protocols."

Tony Chan Carusone et al. (2025)

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DOI: 10.1109/MM.2024.3447711

access: closed

type: Journal Article

metadata version: 2025-04-01

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Tony Chan Carusone, Dustin Dunwell, Sundeep Gupta, Letizia Giuliano, Adrien Auge, Michael Klempa, Sue Hung Fung:
Co-Design of Interchiplet, Package, and System Interconnect Protocols. IEEE Micro 45(1): 35-40 (2025)

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