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ORCIDIEEE Micro, Volume 45
Volume 45, Number 1, January - February 2025
- Hsien-Hsin S. Lee
:
Rise of the Agentic AI Workforce. 4-5 - Debendra Das Sharma, Nam Sung Kim:
Special Issue on Interconnects for Chiplet Integration Technologies. 6-8 - Boyd Phelps, Arif Khan:
Disaggregated Designs: Technology Challenges and Enablers. 9-15 - Peter Z. Onufryk, Swadesh Choudhary:
UCIe: Standard for an Open Chiplet Ecosystem. 16-25 - Au Huynh, Kent Stahn, Manuel Mota, Christian de Verteuil, Jennifer Pyon, Reza Movahedinia:
UCIe Standard: Enhancing Die-to-Die Connectivity in Modern Packaging. 26-34 - Tony Chan Carusone, Dustin Dunwell, Sundeep Gupta, Letizia Giuliano, Adrien Auge, Michael Klempa, Sue Hung Fung:
Co-Design of Interchiplet, Package, and System Interconnect Protocols. 35-40 - Wei Tang, Chester Liu, Zhengya Zhang:
Energy-Efficient Parallel Interconnects for Chiplet Integration. 41-47 - Durand Jarrett-Amor, Tony Chan Carusone:
A Comparison of Single-Ended, NRZ Unidirectional Signaling and Single-Ended, NRZ Simultaneous-Bidirectional Signaling for Die-to-Die Links. 48-56 - Alan Smith, Gabriel H. Loh, Samuel Naffziger, John J. Wuu, Nathan Kalyanasundharam, Eric Chapman, Raja Swaminathan, Tyrone Huang, Wonjun Jung, Alexander Kaganov, Hugh McIntyre, Ramon Mangaser:
Interconnect Design for Heterogeneous Integration of Chiplets in the AMD Instinct MI300X Accelerator. 57-66 - Sridhar Muthrasanallur, Yervant Zorian:
A Test, Debug, and Silicon Lifecycle Management Architecture for a UCIe-Based Open Chiplet Ecosystem. 67-74 - Thommas K. S. Flores, Ivanovitch Silva, Mariana Azevedo, Thaís Medeiros, Morsinaldo Medeiros, Daniel G. Costa, Paolo Ferrari, Emiliano Sisinni:
Advancing Tiny Machine Learning Operations: Robust Model Updates in the Internet of Intelligent Vehicles. 76-86 - Tomasz Szydlo, Marcin Nagy:
Management of TinyML-Enabled Internet of Things Devices. 87-94 - Joshua J. Yi:
A Review of Wisconsin Alumni Research Foundation v. Apple - Part II. 95-100 - Shane Greenstein:
Spillovers, Bottlenecks, and More Invention After Invention. 101-103 - Mariam Elgamal, Yueying Lisa Li:
Measuring What Matters: A Fireside Chat With Joel Emer. 104-112
Volume 45, Number 2, March - April 2025
- Hsien-Hsin S. Lee:
Taiwan Semiconductor Manufacturing Company's $165 Billion Bet. 4-5 - Whit Schonbein, Joseph Schuchart:
Special Issue on Hot Interconnects 31. 6-7 - Quentin Anthony, Benjamin Michalowicz, Jacob Hatef, Lang Xu, Mustafa Abduljabbar, Aamir Shafi, Hari Subramoni, Dhabaleswar K. Panda:
Understanding and Characterizing Communication Characteristics for Distributed Transformer Models. 8-17 - Weiyang Wang, Manya Ghobadi:
Spine-Free Networks for Large Language Model Training. 18-25 - Manjunath Gorentla Venkata, Valentine Petrov, Sergey Lebedev, Devendar Bureddy, Ferrol Aderholdt, Joshua Ladd, Gil Bloch, Mike Dubman, Gilad Shainer:
Unified Collective Communication: A Unified Library for CPU, GPU, and DPU Collectives. 26-35 - Tu Tran, Goutham Kalikrishna Reddy Kuncham, Bharath Ramesh, Shulei Xu, Hari Subramoni, Dhabaleswar K. Panda:
OHIO: Enhancing RDMA Scalability in Alltoall With Optimized Communication Overlap. 36-45 - Jinsun Yoo, William Won, Meghan Cowan, Nan Jiang, Benjamin Klenk, Srinivas Sridharan, Tushar Krishna:
Toward a Standardized Representation for Deep Learning Collective Algorithms. 46-55 - Cristina Olmedilla, Jesús Escudero-Sahuquillo, Pedro Javier García, Francisco J. Quiles, Wenhao Sun, Long Yan, Yunping Lyu, José Duato:
ECP: Improving the Accuracy of Congesting-Packets Identification in High-Performance Interconnection Networks. 56-64 - Ryusuke Egawa, Yasutaka Wada:
Special Issue on COOL Chips. 65-66 - Jueun Jung, Seungbin Kim, Bokyoung Seo, Wuyoung Jang, Sangho Lee, Jeongmin Shin, Donghyeon Han, Kyuho Jason Lee:
A Mobile Semantic Lidar SLAM Processor With Artificial-Intelligence-Based 3-D Perception and Spatiotemporal-Aware Computing. 67-77 - Hoai Luan Pham, Vu Trung Duong Le, Tuan Hai Vu, Van Duy Tran, Van Tinh Nguyen, Thi Diem Tran, Yasuhiko Nakashima:
MRCA 2.0: An Area-Optimized Multigrained Reconfigurable Cryptographic Accelerator for Securing Blockchain-Based Internet of Things Systems. 78-89 - Reoma Matsuo, Yuya Degawa, Hidetsugu Irie, Shuichi Sakai, Ryota Shioya:
Flexible Approximate Computing for Mitigating Branch Divergence in GPUs. 90-100 - Kyungsoo Lee, Sohyun Kim, Joohee Lee, Donguk Moon, Rakie Kim, Honggyu Kim, Hyeongtak Ji, Yunjeong Mun, Youngpyo Joo:
Improving Key-Value Cache Performance With Heterogeneous Memory Tiering: A Case Study of Compute-Express-Link-Based Memory Expansion. 102-113 - Joshua J. Yi:
A Review of Wisconsin Alumni Research Foundation v. Apple - Part III. 114-117 - Shane Greenstein:
Artificial Intelligence and the Jevons Paradox. 118-120 - Doug Burger, Paul Chow, Joel S. Emer, Mark D. Hill, James C. Hoe, Masato Motomura:
Derek Chiou. 122-124
Volume 45, Number 3, May - June 2025
- Hsien-Hsin S. Lee:
Toward Disaggregated and Heterogenous AI Systems. 4-5 - Rob Aitken, Larry Yang:
Special Issue on Hot Chips 2024. 6-7 - Gerard Williams, Pradeep Kanapathipillai:
Qualcomm Oryon CPU in Snapdragon X Elite: Micro-Architecture and Design. 8-14 - Nadav Bonen, Arik Gihon, Leon Polishuk, Yoni Aizik, Yulia Okunev, Tsvika Kurts, Nithiyanandan Bashyam:
Lunar Lake an Intel Mobile Processor: SoC Architecture Overview (2024). 15-21 - Tomai Knopp, Jeffrey Chu, Sagheer Ahmad:
AMD Versal AI Edge Series Gen 2. 22-30 - Michael D. Powell, Patrick Fleming, Venkidesh Iyer Krishna, Naveen Lakkakula, Subhiksha Ravisundar, Praveen Mosur, Arijit Biswas, Pradeep Dubey, Kapil Sood, Andrew Cunningham, Smita Kumar:
Intel Xeon 6 Product Family. 31-40 - Alan Smith, Vamsi Krishna Alla:
AMD Instinct MI300X: A Generative AI Accelerator and Platform Architecture. 41-48 - Kaifan Wang, Jian Chen, Yinan Xu, Zihao Yu, Wei He, Dan Tang, Ninghui Sun, Yungang Bao:
XiangShan: An Open Source Project for High-Performance RISC-V Processors Meeting Industrial-Grade Standards. 49-57 - Kalhan Koul, Zhouhua Xie, Maxwell Strange, Sai Gautham Ravipati, Bo-Wun Cheng, Olivia Hsu, Po-Han Chen, Mark Horowitz, Fredrik Kjolstad, Priyanka Raina:
Designing Programmable Accelerators for Sparse Tensor Algebra. 58-65 - Christopher J. Berry, Michael J. Becht, Tim E. Bubb, Howard Haynie, Robert J. Sonnelitter, Katie Seggerman, Jonathan Hsieh, Edward Malley, Mike Cadigan, Susan M. Eickhoff, Matthias Klein, Craig R. Walters, Christian G. Zoellin, Cédric Lichtenau:
The IBM Telum II Processor. 66-75 - Younggeun Choi, Junyoung Park, Sang Min Lee, Jeseung Yeon, Minho Kim, Changjae Park, Byeongwook Bae, Hyunmin Jeong, Hanjoon Kim, June Paik, Nuno P. Lopes, Sungjoo Yoo:
FuriosaAI RNGD: A Tensor Contraction Processor for Sustainable AI Computing. 76-85 - Antti Rautakoura, Timo Hämäläinen, Ari Kulmala:
Three SoCs in Three Years: How to Get Agile. 86-94 - Joshua J. Yi:
A Review of Wisconsin Alumni Research Foundation v. Apple - Part IV. 97-102 - Jianming Tong, Zishen Wan:
Sipping Matcha of Security: A Fireside Chat With Mengjia Yan. 103-107 - Shane Greenstein:
The Scramble After Breakthrough. 108-110 - Gary S. Tyson:
Sally A. McKee. 112
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