"Thickness dependence of the structural and electrical properties of copper ..."

Kah-Yoong Chan, Teck-Yong Tou, Bee-San Teo (2006)

> Home

Details and statistics

DOI: 10.1016/J.MEJO.2005.09.016

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mj/ChanTT06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mj/ChanTT06
Kah-Yoong Chan, Teck-Yong Tou, Bee-San Teo:
Thickness dependence of the structural and electrical properties of copper films deposited by dc magnetron sputtering technique. Microelectron. J. 37(7): 608-612 (2006)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.