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"On the crack and delamination risk optimization of a Si-interposer for LED ..."
Jürgen Auersperg et al. (2014)
- Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka
, Bernd Michel:
On the crack and delamination risk optimization of a Si-interposer for LED packaging. Microelectron. Reliab. 54(6-7): 1223-1227 (2014)
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