"A novel soldering method to evaluate PCB pad cratering for pin-pull testing."

Miao Cai et al. (2013)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2013.07.025

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/CaiXCWYZ13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/CaiXCWYZ13
Miao Cai, D. J. Xie, W. B. Chen, B. Y. Wu, Dao-Guo Yang, G. Q. Zhang:
A novel soldering method to evaluate PCB pad cratering for pin-pull testing. Microelectron. Reliab. 53(9-11): 1568-1574 (2013)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.