"Fluid-solid coupling thermo-mechanical analysis of high power LED package ..."

Zhaohui Chen et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.03.021

access: closed

type: Journal Article

metadata version: 2020-02-22

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Zhaohui Chen, Qin Zhang, Kai Wang, Mingxiang Chen, Sheng Liu:
Fluid-solid coupling thermo-mechanical analysis of high power LED package during thermal shock testing. Microelectron. Reliab. 52(8): 1726-1734 (2012)

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