"High temperature induced failure in Ti/Al/Ni/Au Ohmic contacts on ..."

Zhihua Dong et al. (2012)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2011.09.021

access: closed

type: Journal Article

metadata version: 2023-09-30

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/DongWWLGYHXSW12
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/DongWWLGYHXSW12
Zhihua Dong, Jinyan Wang, Cheng P. Wen, Shenghou Liu, Rumin Gong, Min Yu, Yilong Hao, Fujun Xu, Bo Shen, Yangyuan Wang:
High temperature induced failure in Ti/Al/Ni/Au Ohmic contacts on AlGaN/GaN heterostructure. Microelectron. Reliab. 52(2): 434-438 (2012)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.