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"Computational modeling of creep-based fatigue as a means of selecting ..."

Jürgen Eckermann et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.02.017

access: closed

type: Journal Article

metadata version: 2020-10-26

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Jürgen Eckermann, Shahid Mehmood, Helen Davies, Nick P. Lavery, Stephen G. R. Brown, Johann Sienz, A. Jones, P. Sommerfeld:
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys. Microelectron. Reliab. 54(6-7): 1235-1242 (2014)

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