"Reliability of TSV interconnects: Electromigration, thermal cycling, and ..."

Thomas Frank et al. (2013)

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DOI: 10.1016/J.MICROREL.2012.06.021

access: closed

type: Journal Article

metadata version: 2023-09-30

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Thomas Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, Emmanuel Chery, F. Lorut, Lorena Anghel, Gilles Poupon:
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. Microelectron. Reliab. 53(1): 17-29 (2013)

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