"Reliability of Cu nanoparticle joint for high temperature power electronics."

Toshitaka Ishizaki et al. (2014)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2014.07.113

access: closed

type: Journal Article

metadata version: 2022-04-01

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/IshizakiKTYOSY14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/IshizakiKTYOSY14
Toshitaka Ishizaki, A. Kuno, A. Tane, Masashi Yanase, F. Osawa, T. Satoh, Yasushi Yamada:
Reliability of Cu nanoparticle joint for high temperature power electronics. Microelectron. Reliab. 54(9-10): 1867-1871 (2014)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.