Stop the war!
Остановите войну!
for scientists:
default search action
"Finite element simulation of package stress in transfer molded MEMS ..."
Rudolf Krondorfer et al. (2004)
- Rudolf Krondorfer, Yeong K. Kim, Jaeok Kim, Claes-Gøran Gustafson, Timothy C. Lommasson:
Finite element simulation of package stress in transfer molded MEMS pressure sensors. Microelectron. Reliab. 44(12): 1995-2002 (2004)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.