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ORCIDMicroelectronics Reliability, Volume 44
Volume 44, Number 1, January 2004
- Enrique Miranda
, Jordi Suñé:
Electron transport through broken down ultra-thin SiO2 layers in MOS devices. 1-23 - Merlyne M. De Souza, S. K. Manhas, D. Chandra Sekhar, A. S. Oates, Prasad Chaparala:
Influence of mobility model on extraction of stress dependent source-drain series resistance. 25-32 - Steven H. Voldman:
A review of electrostatic discharge (ESD) in advanced semiconductor technology. 33-46 - Hyuck In Kwon, In Man Kang, Byung-Gook Park, Jong Duk Lee, Sang Sik Park, Jung Chak Ahn, Yong Hee Lee:
Effects of electrical stress on mid-gap interface trap density and capture cross sections in n-MOSFETs characterized by pulsed interface probing measurements. 47-51 - Mohamed A. Imam, Mohamed A. Osman, Ashraf A. Osman:
Simulation of partially and near fully depleted SOI MOSFET devices and circuits using SPICE compatible physical subcircuit model. 53-63 - Alain Bravaix, Didier Goguenheim, Nathalie Revil, E. Vincent:
Hole injection enhanced hot-carrier degradation in PMOSFETs used for systems on chip applications with 6.5-2 nm thick gate-oxides. 65-77 - Guillaume Bonnet, Patrick Austin, Jean-Louis Sanchez:
New distributed model of NPT IGBT dedicated to power circuits design. 79-88 - Enhai Zhao, Zeynep Çelik-Butler, Frank Thiel, Ranadeep Dutta:
Origin of 1/f noise in lateral PNP bipolar transistors. 89-94 - Josep Altet, Jean-Michel Rampnoux, Jean-Christophe Batsale, Stefan Dilhaire, Antonio Rubio, Wilfrid Claeys, Stéphane Grauby:
Applications of temperature phase measurements to IC testing. 95-103 - Tong Yan Tee, Zhaowei Zhong:
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis. 105-114 - P. Towashiraporn, G. Subbarayan, B. McIlvanie, B. C. Hunter, D. Love, B. Sullivan:
The effect of model building on the accuracy of fatigue life predictions in electronic packages. 115-127 - Rajendra M. Patrikar, K. Murali, Li Er Ping:
Thermal distribution calculations for block level placement in embedded systems. 129-134 - Jad S. Rasul:
Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications. 135-140 - Jiri Jakovenko, Miroslav Husák, Tibor Lalinsky:
Design and simulation of micromechanical thermal converter for RF power sensor microsystem. 141-148 - Taizo Tomioka, Tomohiro Iguchi, Ikuo Mori:
Thermosonic flip-chip bonding for SAW filter. 149-154 - Jong-heon Kim, In-Soo Kang, Chi-jung Song, Young-Jik Hur, Hak-Nam Kim, Esdy Baek, Tae-Jun Seo:
Flip-chip packaging solution for CMOS image sensor device. 155-161 - Enrique Miranda, E. Mallaina:
Single-equation model for low and high voltage soft breakdown conduction. 163-166 - Kyung-Seob Kim, H. I. Kim, C. H. Yu, E. G. Chang:
Fatigue analysis of high-speed photodiode submodule by using FEM. 167-171 - Mile K. Stojcev, Goran Lj. Djordjevic, Tatjana R. Stankovic:
Implementation of self-checking two-level combinational logic on FPGA and CPLD circuits. 173-178 - Mile K. Stojcev:
System on chip design languages; Anne Mignotte, Eugenio Villar, Lynn Horobin, editors, Kluwer Academic Publishers, Boston, 2002. Hardcover, pp 283, plus IX, ISBN 1-4020-7046-2. 179 - Mile K. Stojcev:
Design criteria for low distortion in feedback OPAMP circuits; Bjornar Hernes, Trond Saether, Kluwer Academic Publishers, Boston, 2003. Hardcover, pp 160, plus XXV, ISBN 1-4020-7356-9. 181-182
Volume 44, Number 2, February 2004
- Young-Hee Kim, Jack C. Lee:
Reliability characteristics of high-k dielectrics. 183-193 - Christine S. Hau-Riege:
An introduction to Cu electromigration. 195-205 - Yi-Mu Lee, Yider Wu, Gerald Lucovsky:
Breakdown and reliability of p-MOS devices with stacked RPECVD oxide/nitride gate dielectric under constant voltage stress. 207-212 - Chih-Yao Huang, Wei-Fang Chen, Song-Yu Chuan, Fu-Chien Chiu, Jeng-Chou Tseng, I-Cheng Lin, Chuan-Jane Chao, Len-Yi Leu, Ming-Dou Ker:
Design optimization of ESD protection and latchup prevention for a serial I/O IC. 213-221 - A. Bouhdada, R. Marrakh, F. Vigué, J.-P. Faurie:
Modeling of the spectral response of PIN photodetectors Impact of exposed zone thickness, surface recombination velocity and trap concentration. 223-228 - Takeshi Yanagisawa, Takeshi Kojima, Tadamasa Koyanagi:
Behavior of Cu(In, Ga)Se2 solar cells under light/damp heat over time. 229-235 - Hyun Ho Kim, Byeong Kwon Ju, Yun Hi Lee, Si Hyung Lee, Jeon Kook Lee, Soo Won Kim:
Fabrication of suspended thin film resonator for application of RF bandpass filter. 237-243 - Simone Lee, Ramesh Ramadoss, Michael Buck, V. M. Bright, K. C. Gupta, Y. C. Lee:
Reliability testing of flexible printed circuit-based RF MEMS capacitive switches. 245-250 - Yi Tao, Ajay P. Malshe, William D. Brown:
Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems. 251-258 - Jason Y. L. Goh, Mark C. Pitter, Chung W. See, Michael G. Somekh, Daniel Vanderstraeten:
Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages. 259-267 - Ikuo Shohji, Hideo Mori, Yasumitsu Orii:
Solder joint reliability evaluation of chip scale package using a modified Coffin-Manson equation. 269-274 - Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie:
Materials characterization of the effect of mechanical bending on area array package interconnects. 275-285 - Cristina Lopez, Liang Chai, Aziz Shaikh, Vern Stygar:
Wire bonding characteristics of gold conductors for low temperature co-fired ceramic applications. 287-294 - Y. P. Wu, M. O. Alam, Yan Cheong Chan, B. Y. Wu:
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. 295-302 - Katsuhito Yoshida, Hideaki Morigami:
Thermal properties of diamond/copper composite material. 303-308 - Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl:
Long time reliability study of soldered flip chips on flexible substrates. 309-314 - Seok Hwan Moon, Gunn Hwang, Sang Choon Ko, Youn Tae Kim:
Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon. 315-321 - Esther Wai Ching Yau, Jing Feng Gong, Philip Chan:
Al surface morphology effect on flip-chip solder bump shear strength. 323-331 - Arun Ramakrishnan, Michael G. Pecht:
Load characterization during transportation. 333-338 - Juan A. Carrasco, Víctor Suñé:
Combinatorial methods for the evaluation of yield and operational reliability of fault-tolerant systems-on-chip. 339-350 - Wladyslaw Dabrowski, Pawel Grybos, Tomasz Fiutowski:
Design for good matching in multichannel low-noise amplifier for recording neuronal signals in modern neuroscience experiments. 351-361 - Mile K. Stojcev:
Interconnecting and Computing over Satellite Networks; Yongguang Zhang (Ed.). Kluwer Academic Publishers, Boston, 2003. Hardcover, pp 262, plus XXII, ISBN 1-4020-7424-7. 363-364
Volume 44, Number 3, March 2004
- Baozhen Li, Timothy D. Sullivan, Tom C. Lee, Dinesh Badami:
Reliability challenges for copper interconnects. 365-380 - Ming-C. Cheng, Feixia Yu, Lin Jun, Min Shen, Goodarz Ahmadi:
Steady-state and dynamic thermal models for heat flow analysis of silicon-on-insulator MOSFETs. 381-396 - Greg G. Freeman, Jae-Sung Rieh, Zhijian Yang, Fernando J. Guarín:
Reliability and performance scaling of very high speed SiGe HBTs. 397-410 - K.-H. Allers:
Prediction of dielectric reliability from I-V characteristics: Poole-Frenkel conduction mechanism leading to sqrt(E) model for silicon nitride MIM capacitor. 411-423 - Kyungmee O. Kim, Way Kuo, Wen Luo:
A relation model of gate oxide yield and reliability. 425-434 - Xiangbin Zeng, X. W. Sun, Junfeng Li, Johnny K. O. Sin:
Improving reliability of poly-Si TFTs with channel layer and gate oxide passivated by NH3/N2O plasma. 435-442 - Pierre Temple-Boyer, Jérôme Launay, Iryna Humenyuk, Thierry Do Conto, Augustin Martinez, C. Bériet, A. Grisel:
Study of front-side connected chemical field effect transistor for water analysis. 443-447 - S. Nakajima, S. Nakamura, T. Ueki, T. Sakai:
Sample preparation techniques for physical analysis of VLSIs. 449-458 - Jie-Hua Zhao:
A three-parameter Weibull-like fitting function for flip-chip die strength data. 459-470 - Yu Gu, Toshio Nakamura:
Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages. 471-483 - S. Nurmi, J. Sundelin, Eero Ristolainen, T. Lepistö:
The effect of solder paste composition on the reliability of SnAgCu joints. 485-494 - S. C. Tan, Y. C. Chan, Y. W. Chiu, C. W. Tan:
Thermal stability performance of anisotropic conductive film at different bonding temperatures. 495-503 - M. A. Uddin, M. O. Alam, Yan Cheong Chan, H. P. Chan:
Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. 505-514 - Tadanori Shimoto, Katsumi Kikuchi, Kazuhiro Baba, Koji Matsui, Hirokazu Honda, Keiichiro Kata:
High-performance FCBGA based on multi-layer thin-substrate packaging technology. 515-520 - Beth Keser, Li Wetz, Jerry White:
WL-CSP reliability with various solder alloys and die thicknesses. 521-531 - Li Zhang, Vivek Arora, Luu Nguyen, Nikhil Kelkar:
Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages. 533-541 - R. Khlil, A. El Hdiy, A. F. Shulekin, S. E. Tyaginov, M. I. Vexler:
Soft breakdown of MOS tunnel diodes with a spatially non-uniform oxide thickness. 543-546 - Mile K. Stojcev:
Power-Constrained Testing of VLSI Circuits. Nikola Nikolici, Bashir M. Al-Hashimi. Kluwer Academic Publishers, Boston, 2003. Hardcover, pp 178, plus XI, ISBN 1-4020-7235-X. 547-548
Volume 44, Number 4, April 2004
- Jorge Salcedo-Suñer, Charvaka Duvvury, Roger Cline, Alfonso Cadena-Hernandez:
Latchup in voltage tolerant circuits: a new phenomenon. 549-562 - J. A. Felix, J. R. Schwank, Daniel M. Fleetwood, M. R. Shaneyfelt, Evgeni P. Gusev:
Effects of radiation and charge trapping on the reliability of high-kappa gate dielectrics. 563-575 - Pui-To Lai, Jing-Ping Xu, H. P. Wu, C. L. Chan:
Interfacial properties and reliability of SiO2 grown on 6H-SiC in dry O2 plus trichloroethylene. 577-580 - Guo Lihui, Zhang Yibin, Su Yong Jie Jeffrey:
Integrating thick copper/Black DiamondTM layer in CMOS interconnect process for RF passive components. 581-585 - Teija Uusluoto, Paavo Jalonen, Harri Laaksonen, Aulis Tuominen:
Metallization of microvias by sputter-deposition. 587-593 - N. H. Yeung, Victor Lau, Y. C. Chan:
Bias-HAST on tape ball grid array (TBGA) test pattern. 595-602 - T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma:
The impact of moisture in mold compound preforms on the warpage of PBGA packages. 603-609 - Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath:
Thermo-mechanical finite element analysis in a multichip build up substrate based package design. 611-619 - Kyoungsoon Cho, Insu Jeon:
Numerical analysis of the warpage problem in TSOP. 621-626 - Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang:
Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. 627-638 - Anne Seppälä, Eero Ristolainen:
Study of adhesive flip chip bonding process and failure mechanisms of ACA joints. 639-648 - Juan Santana, Magali Estrada, Ofelia Martinez:
Editorial. 649 - Iosvany León Monzón, Ricardo Amador Pérez, Karl Kohlhof:
Evaluation of MUMPS polysilicon structures for thermal flow sensors. 651-655 - Fernando da Rocha Paixão Cortes, Eric E. Fabris, Sergio Bampi:
Analysis and design of amplifiers and comparators in CMOS 0.35 mum technology. 657-664 - Alessandro Girardi, Sergio Bampi:
AC analysis of an inverter amplifier using minimum-length trapezoidal association of transistors. 665-671 - José Ernesto Rayas-Sánchez:
A frequency-domain approach to interconnect crosstalk simulation and minimization. 673-681 - Joaquín Louzao, Santiago Paz, Daniel Tejera, Gustavo Bellora, Guillermo Langwagen:
Architectural design of a programmable cell for the implementation of a filter bank on FPGA. 683-695 - Luciano Volcan Agostini, Ivan Saraiva Silva, Sergio Bampi:
Parallel color space converters for JPEG image compression. 697-703 - Gang Qu, Miodrag Potkonjak, Mile K. Stojcev:
Book review: Intellectual property protection in VLSI designs: Theory and practice, Hardcover, pp 183, plus XIX, Kluwer Academic Publishers, Boston, 2003, ISBN 1-4020-7320-8. 705-706 - Mile K. Stojcev:
Power estimation and optimization for VLIW-based embedded systems; Vittorio Zaccaria, Mariagiovanna Sami, Donatella Sciuto, Cristina Silvano. Hardcover, pp 203, plus XXIV, Kluwer Academic Publishers, Boston, 2003. ISBN 1-4020-7377-1. 707-708
Volume 44, Number 5, May 2004
- Bing-Liang Yang, P. T. Lai, Hei Wong:
Conduction mechanisms in MOS gate dielectric films. 709-718 - Paul S. Ho, Guotao Wang, Min Ding, Jie-Hua Zhao, Xiang Dai:
Reliability issues for flip-chip packages. 719-737 - Domenico Caputo, Fernanda Irrera:
On the reliability of ZrO2 films for VLSI applications. 739-745 - A. V. Vairagar, S. G. Mhaisalkar, Ahila Krishnamoorthy:
Electromigration behavior of dual-damascene Cu interconnects--Structure, width, and length dependences. 747-754 - Peter Z. F. Shi, Albert C. W. Lu, Y. M. Tan, Stephen C. K. Wong, Eric Tan, Ronson Tan:
Thermal design and experimental validation for optical transmitters. 755-769 - Yoshiteru Yamada, Hirotaka Komoda:
An example of fault site localization on a 0.18 mum CMOS device with combination of front and backside techniques. 771-778 - Zhimin Mo, Helge Kristiansen, Morten Eliassen, Shiming Li, Johan Liu:
Study on thermomechanical reliability of a tunable light modulator. 779-785 - Mark A. Fritz, Daniel T. Cassidy:
Extraction of bonding strain data in diode lasers from polarization-resolved photoluminescence measurements. 787-796 - Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl:
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. 797-803 - Frank Stepniak:
Mechanical loading of flip chip joints before underfill: the impact on yield and reliability. 805-814 - Rashed Adnan Islam, Y. C. Chan:
Effect of microwave preheating on the bonding performance of flip chip on flex joint. 815-821 - C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So:
Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. 823-831 - Jinlin Wang, H. K. Lim, H. S. Lew, Woon Theng Saw, Chew Hong Tan:
A testing method for assessing solder joint reliability of FCBGA packages. 833-840 - X. Q. Shi, John H. L. Pang, X. R. Zhang:
Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. 841-852 - L. Han, Arkady Voloshin:
Statistical analysis for test lands positioning and PCB deformation during electrical testing. 853-859 - Pawel Sniatala, André S. Botha:
A/D converter based on a new memory cell implemented using the switched current technique. 861-867 - Aránzazu Otín, Santiago Celma, Concepción Aldea:
Digitally programmable CMOS transconductor for very high frequency. 869-875 - Oliver Mitea, Manfred Glesner:
A power-constrained design strategy for CMOS tuned low noise amplifiers. 877-883 - V. Sánchez, J. Munguía, Magali Estrada:
Photo-CVD process for ultra thin SiO2 films. 885-888
Volume 44, Number 6, June 2004
- Vassil Palankovski, Siegfried Selberherr:
Rigorous modeling of high-speed semiconductor devices. 889-897 - David Dubuc, M. Saddaoui, S. Mellé, F. Flourens, L. Rabbia, Benoit Ducarouge, Katja Grenier, Patrick Pons, Ali Boukabache, Laurent Bary:
Smart MEMS concept for high secure RF and millimeterwave communications. 899-907 - Rolf-Peter Vollertsen, Ernest Y. Wu:
Voltage acceleration and t63.2 of 1.6-10 nm gate oxides. 909-916 - Insu Jeon, Young-Bae Park:
Analysis of the reservoir effect on electromigration reliability. 917-928 - Zoubir Khatir, Stéphane Lefebvre:
Boundary element analysis of thermal fatigue effects on high power IGBT modules. 929-938 - Maximilian Dammann, Arnulf Leuther, Rüdiger Quay, M. Meng, Helmer Konstanzer, W. Jantz, Michael Mikulla:
Reliability of 70 nm metamorphic HEMTs. 939-943 - Hassène Mnif, Thomas Zimmer, Jean Luc Battaglia, Sébastien Fregonese:
Representation of the SiGe HBT's thermal impedance by linear and recursive networks. 945-950 - Yu Ying, Peter Grant:
Deformation measurement of RF MEMS switches by optical interference. 951-955 - Yingxue Shi, Jing Li, Guijun Hu, Sumei Zhang, Xuedan Wang, Jiawei Shi:
Effects of annealing on the electric noise in semiconductor lasers. 957-961 - Zoran Radivojevic, Klas Andersson, Jeroen A. Bielen, Paul J. van der Wel, Jukka Rantala:
Operating limits for RF power amplifiers at high junction temperatures. 963-972 - C. D. Breach, F. Wulff:
New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al. 973-981 - Jong-Min Kim, Yong-Eui Shin, Kozo Fujimoto:
Dynamic modeling for resin self-alignment mechanism. 983-992 - Markus P. K. Turunen, Pekka Marjamäki, Matti Paajanen, Jouko Lahtinen, Jorma K. Kivilahti:
Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface. 993-1007 - Frøydis Oldervoll, Frode Strisland:
Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures. 1009-1015 - Alireza Ejlali, Seyed Ghassem Miremadi:
FPGA-based Monte Carlo simulation for fault tree analysis. 1017-1028 - Mile K. Stojcev:
Oversampled delta-sigma modulators: analysis applications and novel topologies; Mücahit Kozak, Izzet Kale. Kluwer Academic Publishers, Boston. 2003. Hardcover, pp 226, plus XII, ISBN 1-4020-7420-4. 1029