"Verification of submodeling technique in thermomechanical reliability ..."

Yi-Shao Lai, Tong Hong Wang (2005)

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DOI: 10.1016/J.MICROREL.2004.09.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yi-Shao Lai, Tong Hong Wang:
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly. Microelectron. Reliab. 45(3-4): 575-582 (2005)

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