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"Defect detection of flip-chip solder joints using modal analysis."

Junchao Liu et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.06.135

access: closed

type: Journal Article

metadata version: 2020-02-22

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Junchao Liu, Tielin Shi, Ke Wang, Zirong Tang, Guanglan Liao:
Defect detection of flip-chip solder joints using modal analysis. Microelectron. Reliab. 52(12): 3002-3010 (2012)

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