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"Reliability of sintered Ag80-Al20 die attach ..."

Vemal Raja Manikam, Khairunisak Abdul Razak, Kuan Yew Cheong (2013)

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DOI: 10.1016/J.MICROREL.2012.10.007

access: closed

type: Journal Article

metadata version: 2023-09-30

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Vemal Raja Manikam, Khairunisak Abdul Razak, Kuan Yew Cheong:
Reliability of sintered Ag₈₀-Al₂₀ die attach nanopaste for high temperature applications on SiC power devices. Microelectron. Reliab. 53(3): 473-480 (2013)

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