"Effects of Cu contents in flux on microstructure and joint strength of ..."

Hitoshi Sakurai et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.05.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hitoshi Sakurai, Keun-Soo Kim, Kiju Lee, Chang-Jae Kim, Youichi Kukimoto, Katsuaki Suganuma:
Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish. Microelectron. Reliab. 52(11): 2716-2722 (2012)

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