"Conversion of the under bump metallurgy into intermetallics: the impact on ..."

Frank Stepniak (2001)

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DOI: 10.1016/S0026-2714(01)00015-4

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type: Journal Article

metadata version: 2020-02-22

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Frank Stepniak:
Conversion of the under bump metallurgy into intermetallics: the impact on flip chip reliability. Microelectron. Reliab. 41(5): 735-744 (2001)

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