"Computational modelling for reliable flip-chip packaging at sub-100mum ..."

Stoyan Stoyanov et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.01.004

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type: Journal Article

metadata version: 2022-12-07

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Stoyan Stoyanov, Robert W. Kay, Chris Bailey, Marc P. Y. Desmulliez:
Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives. Microelectron. Reliab. 47(1): 132-141 (2007)

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