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"Thermal stress in through-silicon-vias: Theory-of-elasticity approach."

Ephraim Suhir (2014)

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DOI: 10.1016/J.MICROREL.2014.01.004

access: closed

type: Journal Article

metadata version: 2022-05-19

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Ephraim Suhir:
Thermal stress in through-silicon-vias: Theory-of-elasticity approach. Microelectron. Reliab. 54(5): 972-977 (2014)

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