Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging."

Jianxin Wang, Hiroshi Nishikawa (2014)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2014.03.007

access: closed

type: Journal Article

metadata version: 2023-01-09

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/WangN14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/WangN14
Jianxin Wang, Hiroshi Nishikawa:
Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging. Microelectron. Reliab. 54(8): 1583-1591 (2014)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.