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"Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging."
Jianxin Wang, Hiroshi Nishikawa (2014)
- Jianxin Wang
, Hiroshi Nishikawa
:
Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging. Microelectron. Reliab. 54(8): 1583-1591 (2014)
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