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"Transient analysis of the impact stage of wirebonding on Cu/low-K wafers."

Chang-Lin Yeh, Yi-Shao Lai (2005)

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DOI: 10.1016/J.MICROREL.2004.04.026

access: closed

type: Journal Article

metadata version: 2020-02-22

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Chang-Lin Yeh, Yi-Shao Lai:
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. Microelectron. Reliab. 45(2): 371-378 (2005)

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