"High temperature reliability and interfacial reaction of eutectic ..."

Jeong-Won Yoon, Seung-Boo Jung (2006)

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DOI: 10.1016/J.MICROREL.2005.05.009

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jeong-Won Yoon, Seung-Boo Jung:
High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. Microelectron. Reliab. 46(5-6): 905-914 (2006)

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