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Seung-Boo Jung
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2010 – 2019
- 2016
- [j10]Dae Up Kim, Kwang-Seok Kim, Seung-Boo Jung:
Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications. Microelectron. Reliab. 63: 120-124 (2016) - 2014
- [j9]Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung:
Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions. Microelectron. Reliab. 54(2): 410-416 (2014) - 2013
- [j8]Jeong-Won Yoon, Min-Kwan Ko, Bo-In Noh, Seung-Boo Jung:
Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test. Microelectron. Reliab. 53(12): 2036-2042 (2013)
2000 – 2009
- 2008
- [j7]Bo-In Noh, Jong-Bum Lee, Seung-Boo Jung:
Effect of surface finish material on printed circuit board for electrochemical migration. Microelectron. Reliab. 48(4): 652-656 (2008) - [j6]Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung:
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. Microelectron. Reliab. 48(11-12): 1857-1863 (2008) - [j5]Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung:
Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint. Microelectron. Reliab. 48(11-12): 1864-1874 (2008) - [j4]Jong-Woong Kim, Jin-Kyu Jang, Sang-Ok Ha, Sang-Su Ha, Dae-Gon Kim, Seung-Boo Jung:
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint. Microelectron. Reliab. 48(11-12): 1882-1889 (2008) - 2007
- [j3]Ja-Myeong Koo, Seung-Boo Jung:
Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging. Microelectron. Reliab. 47(12): 2169-2178 (2007) - [i2]Ja-Myeong Koo, Seung-Boo Jung:
Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package. CoRR abs/0711.3306 (2007) - [i1]Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung:
Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications. CoRR abs/0711.3323 (2007) - 2006
- [j2]Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung:
Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application. Microelectron. Reliab. 46(2-4): 535-542 (2006) - [j1]Jeong-Won Yoon, Seung-Boo Jung:
High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. Microelectron. Reliab. 46(5-6): 905-914 (2006)
Coauthor Index
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