"Solder interconnect reliability under drop impact loading conditions using ..."

Jeroen J. M. Zaal et al. (2009)

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DOI: 10.1016/J.MICROREL.2009.03.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang:
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. Microelectron. Reliab. 49(8): 846-852 (2009)

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