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"Numerical and experimental analysis of large passivation opening for ..."
Li Zhang et al. (2004)
- Li Zhang, Vivek Arora, Luu Nguyen, Nikhil Kelkar:
Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages. Microelectron. Reliab. 44(3): 533-541 (2004)
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