"Effect of electroplating layer structure on shear property and ..."

Qinghua Zhao et al. (2013)

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DOI: 10.1016/J.MICROREL.2012.08.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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Qinghua Zhao, Anmin Hu, Ming Li, Jiangyan Sun:
Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps. Microelectron. Reliab. 53(2): 321-326 (2013)

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