"Packaging of integrated solid-state power assembly cells: a ..."

Michael C. Shaw, Bruce C. Beihoff (2001)

> Home

Details and statistics

DOI: 10.1109/5.931476

access: closed

type: Journal Article

metadata version: 2021-08-17

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/pieee/ShawB01
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/pieee/ShawB01
Michael C. Shaw, Bruce C. Beihoff:
Packaging of integrated solid-state power assembly cells: a thermomechanics-based approach. Proc. IEEE 89(6): 856-863 (2001)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.