"A Fast Semi-Analytic Approach for Combined Electromigration and ..."

Liang Chen et al. (2021)

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DOI: 10.1109/TCAD.2020.2994271

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type: Journal Article

metadata version: 2023-12-19

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Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao:
A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(2): 350-363 (2021)

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