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"Planning Massive Interconnects in 3-D Chips."

Johann Knechtel, Evangeline F. Y. Young, Jens Lienig (2015)

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DOI: 10.1109/TCAD.2015.2432141

access: closed

type: Journal Article

metadata version: 2020-09-24

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  - journals/tcad/KnechtelYL15
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  - https://dblp.org/rec/journals/tcad/KnechtelYL15
Johann Knechtel, Evangeline F. Y. Young, Jens Lienig:
Planning Massive Interconnects in 3-D Chips. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34(11): 1808-1821 (2015)

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