"Substrate Topological Routing for High-Density Packages."

Shenghua Liu et al. (2009)

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DOI: 10.1109/TCAD.2008.2009154

access: closed

type: Journal Article

metadata version: 2020-09-24

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Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Tianpei Zhang, Robi Dutta, Xianlong Hong:
Substrate Topological Routing for High-Density Packages. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 28(2): 207-216 (2009)

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