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"Block-level 3-D Global Routing With an Application to 3-D Packaging."

Jacob R. Minz, Sung Kyu Lim (2006)

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DOI: 10.1109/TCAD.2005.860952

access: closed

type: Journal Article

metadata version: 2022-10-02

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Jacob R. Minz, Sung Kyu Lim:
Block-level 3-D Global Routing With an Application to 3-D Packaging. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 25(10): 2248-2257 (2006)

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