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"Fast Electromigration Immortality Analysis for Multisegment Copper ..."

Zeyu Sun et al. (2018)

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DOI: 10.1109/TCAD.2018.2801221

access: closed

type: Journal Article

metadata version: 2021-02-19

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Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan:
Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37(12): 3137-3150 (2018)

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