"Glass Interposer Integration of Logic and Memory Chiplets: PPA and ..."

Pruek Vanna-Iampikul et al. (2025)

> Home

Details and statistics

DOI: 10.1109/TCAD.2024.3504361

access: closed

type: Journal Article

metadata version: 2025-05-09

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tcad/VannaIampikulWEZKAGRSL25
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcad/VannaIampikulWEZKAGRSL25
Pruek Vanna-Iampikul, Seungmin Woo, Serhat Erdogan, Lingjun Zhu, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Madhavan Swaminathan, Sung Kyu Lim:
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 44(5): 1954-1967 (2025)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.