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Publication search results
found 26 matches
- 2020
- Chen Chen, Xiaoyan Xiang, Chang Liu, Yunhai Shang, Ren Guo, Dongqi Liu, Yimin Lu, Ziyi Hao, Jiahui Luo, Zhijian Chen, Chunqiang Li, Yu Pu, Jianyi Meng, Xiaolang Yan, Yuan Xie, Xiaoning Qi:
Xuantie-910: Innovating Cloud and Edge Computing by RISC-V. Hot Chips Symposium 2020: 1-19 - Anurag Agrawal, Changhoon Kim:
Intel Tofino2 - A 12.9Tbps P4-Programmable Ethernet Switch. Hot Chips Symposium 2020: 1-32 - Jeff Andrews, Mark Grossman:
Xbox Series X System Architecture. Hot Chips Symposium 2020: 1-29 - Sonu Arora, Dan Bouvier, Chris Weaver:
AMD Next Generation 7NM Ryzen™ 4000 APU "Renoir". Hot Chips Symposium 2020: 1-30 - Ljubisa Bajic, Jasmina Vasiljevic:
Compute substrate for Software 2.0. Hot Chips Symposium 2020: 1-31 - Dan Belov:
AI Research at Scale-Opportunities on the Road Ahead. Hot Chips Symposium 2020: 1-88 - David Blythe:
The Xe GPU Architecture. Hot Chips Symposium 2020: 1-27 - Jack Choquette, Wish Gandhi:
NVIDIA A100 GPU: Performance & Innovation for GPU Computing. Hot Chips Symposium 2020: 1-43 - Ilya K. Ganusov, Mahesh A. Iyer
, Ning Cheng, Alon Meisler:
Agilex™ Generation of Intel® FPGAs. Hot Chips Symposium 2020: 1-26 - Yang Jiao, Liang Han, Xin Long:
Hanguang 800 NPU - The Ultimate AI Inference Solution for Data Centers. Hot Chips Symposium 2020: 1-29 - Glenn G. Ko, Yuji Chai, Marco Donato, Paul N. Whatmough, Thierry Tambe
, Rob A. Rutenbar
, Gu-Yeon Wei, David Brooks:
A Scalable Bayesian Inference Accelerator for Unsupervised Learning. Hot Chips Symposium 2020: 1-27 - Francis Matus:
Distributed Services Architecture. Hot Chips Symposium 2020: 1-17 - Thomas Norrie, Nishant Patil, Doe Hyun Yoon, George Kurian, Sheng Li, James Laudon, Cliff Young, Norman P. Jouppi, David A. Patterson:
Google's Training Chips Revealed: TPUv2 and TPUv3. Hot Chips Symposium 2020: 1-70 - Jian Ouyang, Mijung Noh, Yong Wang, Wei Qi, Yin Ma, Canghai Gu, SoonGon Kim, Ki-il Hong, Wang-Keun Bae, Zhibiao Zhao, Jing Wang, Peng Wu, Xiaozhang Gong, Jiaxin Shi, Hefei Zhu, Xueliang Du
:
Baidu Kunlun An AI processor for diversified workloads. Hot Chips Symposium 2020: 1-18 - Irma Esmer Papazian:
New 3rd Gen Intel® Xeon® Scalable Processor (Codename: Ice Lake-SP). Hot Chips Symposium 2020: 1-22 - Carl Ramey:
Silicon Photonics for Artificial Intelligence Acceleration : HotChips 32. Hot Chips Symposium 2020: 1-26 - Anthony Saporito:
The IBM z15 processor chip set. Hot Chips Symposium 2020: 1-17 - Allan Skillman, Tomas Edsö:
A Technical Overview of Cortex-M55 and Ethos-U55: Arm's Most Capable Processors for Endpoint AI. Hot Chips Symposium 2020: 1-20 - William J. Starke, Brian W. Thompto:
IBM's POWER10 Processor. Hot Chips Symposium 2020: 1-43 - Rabin Sugumar:
ThunderX3 Next-Generation Arm-Based Server. Hot Chips Symposium 2020: 1-19 - Xavier Vera:
Inside Tiger Lake: Intel's Next Generation Mobile Client CPU. Hot Chips Symposium 2020: 1-26 - Martin Voogel, Yohan Frans, Matt Ouellette, Jason Coppens, Sagheer Ahmad, Jaideep Dastidar, Ehab Mohsen, Faisal Dada, Mike Thompson, Ralph Wittig, Trevor Bauer, Gaurav Singh:
Xilinx Versal™ Premium. Hot Chips Symposium 2020: 1-46 - Florian Zaruba, Fabian Schuiki, Luca Benini:
A 4096-core RISC-V Chiplet Architecture for Ultra-efficient Floating-point Computing. Hot Chips Symposium 2020: 1-24 - Xiantao Zxt, Zhengxiao Zx, Justin Song:
High-density Multi-tenant Bare-metal Cloud with Memory Expansion SoC and Power Management. Hot Chips Symposium 2020: 1-18 - Hot Chips 2020 Posters. Hot Chips Symposium 2020: 1-159
- IEEE Hot Chips 32 Symposium, HCS 2020, Palo Alto, CA, USA, August 16-18, 2020. IEEE 2020, ISBN 978-1-7281-7129-6 [contents]
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