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Yangyang Yan
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2020 – today
- 2022
- [j5]Fengwei Dai, David Wei Zhang, Yangyang Yan, Guojun Wang, Liqiang Cao:
Research on Ni3Sn4 intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps. IEICE Electron. Express 19(2): 20210453 (2022) - [j4]Yangyang Yan, Hui Lei, Yihong Chen, Bin Zhou:
Analyzing the Dynamic Spatiotemporal Changes in Urban Extension across Zhejiang Province Using NPP-VIIRS Nighttime Light Data. Remote. Sens. 14(13): 3212 (2022) - [j3]Guoxian Yu
, Yeqian Yang, Yangyang Yan, Maozu Guo
, Xiangliang Zhang
, Jun Wang
:
DeepIDA: Predicting Isoform-Disease Associations by Data Fusion and Deep Neural Networks. IEEE ACM Trans. Comput. Biol. Bioinform. 19(4): 2166-2176 (2022) - 2020
- [j2]Yangyang Yan
, Yaping Fan:
Influence of Fluid on Seal and Assembly of Pipeline Fittings Based on the Multiscale Finite Element Model. Complex. 2020: 4960734:1-4960734:12 (2020)
2010 – 2019
- 2016
- [c2]Yangyang Yan, Ziyue Zhang
, Zhiqiang Cheng
, Lingfeng Zhou, Zhiming Chen, Yingtao Ding:
Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias. 3DIC 2016: 1-5 - 2015
- [c1]Yangyang Yan, Yingtao Ding, Qianwen Chen, Kang Wook Lee, Takafumi Fukushima
, Mitsumasa Koyanagi:
Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications. 3DIC 2015: TS5.2.1-TS5.2.5 - 2014
- [j1]Yingtao Ding, Yangyang Yan, Qianwen Chen, Shiwei Wang, Rui Su, Hua Dang:
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner. Microelectron. Reliab. 54(6-7): 1384-1391 (2014)
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