"Stress-driven 3D-IC placement with TSV keep-out zone and regularity study."

Krit Athikulwongse et al. (2010)

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DOI: 10.1109/ICCAD.2010.5654245

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Krit Athikulwongse, Ashutosh Chakraborty, Jae-Seok Yang, David Z. Pan, Sung Kyu Lim:
Stress-driven 3D-IC placement with TSV keep-out zone and regularity study. ICCAD 2010: 669-674

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