"A holistic analysis of circuit timing variations in 3D-ICs with thermal ..."

Sravan K. Marella, Sanjay V. Kumar, Sachin S. Sapatnekar (2012)

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DOI: 10.1145/2429384.2429450

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-09

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Sravan K. Marella, Sanjay V. Kumar, Sachin S. Sapatnekar:
A holistic analysis of circuit timing variations in 3D-ICs with thermal and TSV-induced stress considerations. ICCAD 2012: 317-324

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