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"Building block multi-chip systems using inductive coupling through chip ..."

Hideharu Amano et al. (2017)

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DOI: 10.1109/ISOCC.2017.8368842

access: closed

type: Conference or Workshop Paper

metadata version: 2024-03-21

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  - conf/isocc/AmanoKNUKMN17
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Hideharu Amano, Tadahiro Kuroda, Hiroshi Nakamura, Kimiyoshi Usami, Masaaki Kondo, Hiroki Matsutani, Mitaro Namiki:
Building block multi-chip systems using inductive coupling through chip interface. ISOCC 2017: 152-154

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