"ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for ..."

Hyunsu Chae et al. (2024)

> Home

Details and statistics

DOI: 10.1109/TCAD.2023.3305934

access: closed

type: Journal Article

metadata version: 2024-01-13

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tcad/ChaeZMWWARKP24
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcad/ChaeZMWWARKP24
Hyunsu Chae, Keren Zhu, Bhyrav Mutnury, Douglas Wallace, Douglas Winterberg, Daniel De Araujo, Jay Reddy, Adam R. Klivans, David Z. Pan:
ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43(1): 2-15 (2024)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.