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2010 – 2019
- 2018
[j7]Yi Chao Low
, Pik Kee Tan, Soon Leng Tan, Yuzhe Zhao, Jeffrey Lam:
Solving 28 nm I/O circuit reliability issue due to IC design weakness. Microelectron. Reliab. 88-90: 246-249 (2018)- [j6]Pik Kee Tan, Yuzhe Zhao, Francis Rivai, Binghai Liu, Yanlin Pan, Ran He, Hao Tan, Zhihong Mai:
Cross-sectional nanoprobing sample preparation on sub-micron device with fast laser grooving technique. Microelectron. Reliab. 88-90: 309-314 (2018) - [j5]Shaalini Chithambaram, Pik Kee Tan, Yuzhe Zhao, Binghai Liu, Yinzhe Ma, Alfred Quah, Dayanand Nagalingam, Yanlin Pan, Zhihong Mai:
Failure analysis on 14 nm FinFET devices with ESD CDM failure. Microelectron. Reliab. 88-90: 321-333 (2018) - 2016
- [j4]Pik Kee Tan, Huei Hao Yap, Changqing Chen, Francis Rivai, Yuzhe Zhao, Lei Zhu, Hua Feng, Hao Tan, Ran He, D. D. Wang, Y. M. Huang, Yin Zhe Ma, Jeffrey Lam, Zhi Hong Mai:
Cross-sectional nanoprobing fault isolation technique on submicron devices. Microelectron. Reliab. 64: 321-325 (2016) - [j3]Huei Hao Yap, Pik Kee Tan, Lei Zhu, H. Feng, Yuzhe Zhao, Ran He, Hao Tan, B. Liu, Y. M. Huang, D. D. Wang, Jeffrey Lam, Zhihong Mai:
Application of laser deprocessing technique in PFA on chemical over-etched on bond-pad issue. Microelectron. Reliab. 64: 357-361 (2016) - [j2]Yuzhe Zhao, Q. J. Wang, Pik Kee Tan, Huei Hao Yap, Binghai Liu, H. Feng, Hao Tan, Ran He, Y. M. Huang, D. D. Wang, Lei Zhu, C. Q. Chen, Francis Rivai, Jeffrey Lam, Zhihong Mai:
Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system. Microelectron. Reliab. 64: 362-366 (2016) - 2015
- [j1]Huei Hao Yap, Pik Kee Tan, G. R. Low, M. K. Dawood, Hua Feng, Yuzhe Zhao, Ran He, Hao Tan, J. Zhu, Binghai Liu, Y. M. Huang, D. D. Wang, Jeffrey Lam, Zhihong Mai:
Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique. Microelectron. Reliab. 55(9-10): 1611-1616 (2015)
Coauthor Index
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