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ORCIDValeriy Sukharev
- > Home > Persons > Valeriy Sukharev
Publications
- 2024
[c27]Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, J. Shuster-Passage, Seungman Choi, M. Gall:
A Unified Physics-Based Stochastic Model for EM-Induced Resistance Degradation in BEoL Interconnect Segments. IRPS 2024: 1-10- [c25]J. Shuster-Passage, S. Abdel Razek, M. Mattoo, Meike Hauschildt, Seungman Choi, Martin Gall, Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Matthias Kraatz, J. R. Lloyd:
A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses. IRPS 2024: 10 - [c24]Jun-Ho Choy
, Stéphane Moreau, Catherine Brunet-Manquat, Valeriy Sukharev, Armen Kteyan:
Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects. ISPD 2024: 85-90 - 2023
- [c22]Armen Kteyan, Valeriy Sukharev, Alexander Volkov, Jun-Ho Choy, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Stéphane Moreau:
Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution. ISPD 2023: 124-132 - 2022
- [j9]Valeriy Sukharev, Armen Kteyan, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Jun-Ho Choy, Sofya Torosyan, Yu Zhu:
Experimental Validation of a Novel Methodology for Electromigration Assessment in On-Chip Power Grids. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(11): 4837-4850 (2022) - [c20]Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Massimo Bertoletti, Carmelo Maiorca, Rossana Zadra, Massimo Inzaghi, Gabriele Gattere, Giancarlo Zinco, Paolo Valente, Roberto Bardelli, Alessandro Valerio, Pierluigi Rolandi, Mattia Monetti, Valentina Cuomo, Salvatore Santapa:
Novel Methodology for Assessing Chip-Package Interaction Effects onChip Performance. ISPD 2022: 83-89 - 2019
- [c18]Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy:
An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems. 3DIC 2019: 1-6 - [c16]Armen Kteyan, Henrik Hovsepyan, Jun-Ho Choy, Valeriy Sukharev:
Assesment of CPI Stress Impact on IC Reliability and Performance in 2.5D/3D Packages. IRPS 2019: 1-7 - 2016
- [j6]Xin Huang, Valeriy Sukharev, Jun-Ho Choy, Marko Chew, Taeyoung Kim, Sheldon X.-D. Tan:
Electromigration assessment for power grid networks considering temperature and thermal stress effects. Integr. 55: 307-315 (2016) - 2015
- [c7]Jun-Ho Choy, Valeriy Sukharev, Armen Kteyan, Henrik Hovsepyan, Ramnath Venkatraman, Ruggero Castagnetti:
Post placement leakage reduction with stress-enhanced filler cells. ISLPED 2015: 303-308 - 2012
- [j3]Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy, Henrik Hovsepyan, Ara Markosian, Ehrenfried Zschech, Rene Huebner:
Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance. J. Electron. Test. 28(1): 63-72 (2012) - 2009
- [c2]Valeriy Sukharev, Ara Markosian, Armen Kteyan, Levon Manukyan, Nikolay Khachatryan, Jun-Ho Choy, Hasmik Lazaryan, Henrik Hovsepyan, Seiji Onoue, Takuo Kikuchi, Tetsuya Kamigaki:
Control of design specific variation in etch-assisted via pattern transfer by means of full-chip simulation. ISQED 2009: 156-161
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