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ORCIDYoriko Mizushima
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2010 – 2019
- 2015
[j1]Takayuki Ohba, Young-Suk Kim, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama:
Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation. IEICE Electron. Express 12(7): 20152002 (2015)- [c6]Tomoji Nakamura, Yoriko Mizushima, Young-Suk Kim, Ryuichi Sugie
, Takayuki Ohba:
Characterization of stress distribution in ultra-thinned DRAM wafer. 3DIC 2015: TS3.2.1-TS3.2.5 - 2014
- [c5]Yoriko Mizushima, Young-Suk Kim, Tomoji Nakamura, Shoichi Kodama, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba:
Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure. 3DIC 2014: 1-5 - 2013
- [c4]Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba:
Influence of wafer thinning process on backside damage in 3D integration. 3DIC 2013: 1-6 - 2011
- [c3]Nobuhide Maeda, Young-Suk Kim, Y. Hikosaka, T. Eshita, Hideki Kitada, K. Fujimoto, Yoriko Mizushima, K. Suzuki, Tadao Nakamura, Akihito Kawai, Kazuhisa Arai, Takayuki Ohba:
Development of ultra-thinning technology for logic and memory heterogeneous stack applications. 3DIC 2011: 1-4 - [c2]Tomoji Nakamura, Hideki Kitada, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba:
Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects. 3DIC 2011: 1-4 - [c1]Osamu Nakatsuka, Hideki Kitada, Young-Suk Kim, Yoriko Mizushima, Tomoji Nakamura, Takayuki Ohba, Shigeaki Zaima:
Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures. 3DIC 2011: 1-4
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