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ORCIDCyril Buttay
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2020 – today
- 2024
[j14]Oriol Avino-Salvado
, Cyril Buttay, Ferran Bonet, Christophe Raynaud, Pascal Bevilacqua, José Rebollo, Hervé Morel, Xavier Perpiñà:
Physics-Based Strategies for Fast TDDB Testing and Lifetime Estimation in SiC Power MOSFETs. IEEE Trans. Ind. Electron. 71(5): 5285-5295 (2024)- 2023
- [j13]Pierre Le Métayer, Quentin Loeuillet, François Wallart, Cyril Buttay, Drazen Dujic, Piotr Dworakowski:
Phase-Shifted Full Bridge DC-DC Converter for Photovoltaic MVDC Power Collection Networks. IEEE Access 11: 19039-19048 (2023) - 2022
- [j12]Somya Anand, Eric Vagnon, Martin Guillet, Cyril Buttay:
Optical Detection of Partial Discharges Under Fast Rising Square Voltages in Dielectric Liquids. IEEE Access 10: 89758-89768 (2022)
2010 – 2019
- 2019
- [c6]Thilini Wickramasinghe, Stephane Azzopardi, Bruno Allard, Cyril Buttay, Charles Joubert, Christian Martin, Jean-François Mogniotte, Hervé Morel, Pascal Bevilacqua, Thanh-Long Le:
A Study on Shunt Resistor-based Current Measurements for Fast Switching GaN Devices. IECON 2019: 1573-1578 - 2018
- [j11]Oriol Avino-Salvado, Hervé Morel, Cyril Buttay, Denis Labrousse, Stéphane Lefebvre:
Threshold voltage instability in SiC MOSFETs as a consequence of current conduction in their body diode. Microelectron. Reliab. 88-90: 636-640 (2018) - [c5]Thomas Lagier, Laurent Chedot, François Wallart, Layal Ghossein, Bruno Lefebvre, Piotr Dworakowski, Michel Mermet-Guyennet, Cyril Buttay:
A 100 kW 1.2 kV 20 kHz DC-DC converter prototype based on the Dual Active Bridge topology. ICIT 2018: 559-564 - [c4]Remy Caillaud, Cyril Buttay, Roberto M'Rad, Johan Le Lesle, Florent Morel, Nicolas Degrenne, Stefan Mollov, Christian Martin:
Design, manufacturing and characterization of printed circuit board embedded inductors for power applications. ICIT 2018: 694-699 - [c3]Maxime Semard, Christian Martin, Cyril Buttay, Charles Joubert:
High-temperature coplanar transformer. ICIT 2018: 730-735 - [c2]Johan Le Lesle, Remy Caillaud, Florent Morel, Nicolas Degrenne, Cyril Buttay, Roberto M'Rad, Christian Vollaire, Stefan Mollov:
Optimum design of a single-phase Power Pulsating Buffer (PPB) with PCB-integrated inductor technologies. ICIT 2018: 782-787 - [c1]Cyril Buttay, Raphel Riva, Bruno Allard, Marie-Laure Locatelli, Vincent Bley:
Packaging with Double-Side Cooling Capability for SiC Devices, Based on Silver Sintering. IECON 2018: 5753-5759 - 2017
- [j10]Wissam Sabbah, Pierre Bondue, Oriol Avino-Salvado, Cyril Buttay, Hélène Frémont, Alexandrine Guédon-Gracia, Hervé Morel:
High temperature ageing of microelectronics assemblies with SAC solder joints. Microelectron. Reliab. 76-77: 362-367 (2017) - [j9]Ilyas Dchar, Cyril Buttay, Hervé Morel:
SiC power devices packaging with a short-circuit failure mode capability. Microelectron. Reliab. 76-77: 400-404 (2017) - [j8]Wissam Sabbah, Faical Arabi, Oriol Avino-Salvado, Cyril Buttay, L. Théolier, Hervé Morel:
Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling. Microelectron. Reliab. 76-77: 444-449 (2017) - [j7]A. Ben Kabaar, Cyril Buttay, O. Dezellus, R. Estevez, Anthony Gravouil, Laurent Gremillard:
Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications. Microelectron. Reliab. 79: 288-296 (2017) - 2016
- [j6]Ilyas Dchar, Cyril Buttay, Hervé Morel:
Avalanche robustness of SiC Schottky diode. Microelectron. Reliab. 64: 494-501 (2016) - 2015
- [j5]Cheng Chen, Denis Labrousse, Stéphane Lefebvre, Mickael Petit, Cyril Buttay, Hervé Morel:
Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs. Microelectron. Reliab. 55(9-10): 1708-1713 (2015) - 2014
- [j4]Faouzi Kahlouche, Khamis Youssouf, Mahamat Hassan Béchir, Stéphane Capraro, Ali Siblini, Jean-Pierre Chatelon, Cyril Buttay, Jean Jacques Rousseau:
Fabrication and characterization of a planar interleaved micro-transformer with magnetic core. Microelectron. J. 45(7): 893-897 (2014) - 2013
- [j3]Raphel Riva, Cyril Buttay, Bruno Allard, Pascal Bevilacqua:
Migration issues in sintered-silver die attaches operating at high temperature. Microelectron. Reliab. 53(9-11): 1592-1596 (2013) - [j2]Wissam Sabbah, Stephane Azzopardi, Cyril Buttay, Régis Meuret, Eric Woirgard:
Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy. Microelectron. Reliab. 53(9-11): 1617-1621 (2013)
2000 – 2009
- 2009
- [j1]Florent Morel, Xuefang Lin-Shi, Jean-Marie Retif, Bruno Allard, Cyril Buttay:
A Comparative Study of Predictive Current Control Schemes for a Permanent-Magnet Synchronous Machine Drive. IEEE Trans. Ind. Electron. 56(7): 2715-2728 (2009)
Coauthor Index
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