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ORCIDHélène Frémont
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2020 – today
- 2023
[c5]Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne:
Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits. IRPS 2023: 1-7- 2022
- [c4]Bassel Ayoub, Stéphane Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei
, Hélène Frémont:
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects. IRPS 2022: 4 - 2020
- [c3]Quentin Vandier, Julien Pezard, Hélène Frémont, Éric Duchesne, Dominique Drouin:
Readout Circuit Implemented on PCB-Level for Embedded CNT Sensors. I2MTC 2020: 1-6
2010 – 2019
- 2019
- [j37]Aurore Quelennec, Éric Duchesne, Hélène Frémont, Dominique Drouin:
Source Separation Using Sensor's Frequency Response: Theory and Practice on Carbon Nanotubes Sensors. Sensors 19(15): 3389 (2019) - 2018
- [j36]Faical Arabi, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont:
Sequential combined thermal cycling and vibration test and simulation of printed circuit board. Microelectron. Reliab. 88-90: 768-773 (2018) - [j35]S. Pin, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont:
Creep measurement and choice of creep laws for BGA assemblies' reliability simulation. Microelectron. Reliab. 88-90: 1172-1176 (2018) - 2017
- [j34]Nathalie Labat, François Marc, Hélène Frémont, Marise Bafleur:
Proceedings of the 28th European Symposium on the reliability of electron devices, failure physics and analysis. Microelectron. Reliab. 76-77: 1-5 (2017) - [j33]Wissam Sabbah, Pierre Bondue, Oriol Avino-Salvado, Cyril Buttay, Hélène Frémont, Alexandrine Guédon-Gracia, Hervé Morel:
High temperature ageing of microelectronics assemblies with SAC solder joints. Microelectron. Reliab. 76-77: 362-367 (2017) - [j32]S. Pin, Hélène Frémont, Alexandrine Guédon-Gracia:
Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations. Microelectron. Reliab. 76-77: 368-372 (2017) - [j31]S. Hairoud-Airieau, Geneviève Duchamp, Tristan Dubois, Jean-Yves Delétage, André Durier, Hélène Frémont:
Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach. Microelectron. Reliab. 76-77: 674-679 (2017) - 2016
- [j30]Alexandrine Guédon-Gracia, Hélène Frémont, Bernard Plano, Jean-Yves Delétage, Kirsten Weide-Zaage:
Effects of salt spray test on lead-free solder alloy. Microelectron. Reliab. 64: 242-247 (2016) - 2015
- [j29]Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano:
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. Microelectron. Reliab. 55(1): 192-200 (2015) - [j28]Marise Bafleur, Philippe Perdu, François Marc, Hélène Frémont, Nicolas Nolhier:
Editorial. Microelectron. Reliab. 55(9-10): 1269-1270 (2015) - [j27]Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont:
Dynamical IMC-growth calculation. Microelectron. Reliab. 55(9-10): 1832-1837 (2015) - [j26]Samed Barnat, Alexandrine Guédon-Gracia, Hélène Frémont:
Virtual prototyping in a Design-for-Reliability approach. Microelectron. Reliab. 55(9-10): 1849-1854 (2015) - [j25]Tristan Dubois, Siham Hairoud, Marcio Hermany Gomes de Oliveira, Hélène Frémont, Geneviève Duchamp:
Characterization and model of temperature effect on the conducted immunity of Op-Amp. Microelectron. Reliab. 55(9-10): 2055-2060 (2015) - [j24]André Durier, Alain Bensoussan, Moustafa Zerarka, Chaimae Ghfiri, Alexandre Boyer, Hélène Frémont:
A methodologic project to characterize and model COTS component reliability. Microelectron. Reliab. 55(9-10): 2097-2102 (2015) - 2014
- [j23]Hélène Frémont, Jörg Kludt, Massar Wade, Kirsten Weide-Zaage, Isabelle Bord-Majek, Geneviève Duchamp:
Qualification procedure for moisture in embedded capacitors. Microelectron. Reliab. 54(9-10): 2013-2016 (2014) - 2013
- [j22]W. Ben Naceur, Nathalie Malbert, Nathalie Labat, Hélène Frémont, D. Carisetti, J. C. Clement, J. L. Muraro, Barbara Bonnet:
Failure analysis of GaAs microwave devices with plastic encapsulation by electro-optical techniques. Microelectron. Reliab. 53(9-11): 1375-1380 (2013) - [j21]Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano:
Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads. Microelectron. Reliab. 53(9-11): 1575-1580 (2013) - [j20]J. B. Jullien, Hélène Frémont, Jean-Yves Delétage:
Conductive adhesive joint for extreme temperature applications. Microelectron. Reliab. 53(9-11): 1597-1601 (2013) - 2012
- [j19]Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage:
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers. Microelectron. Reliab. 52(9-10): 1827-1832 (2012) - [j18]Samed Barnat, Hélène Frémont, Alexandrine Guédon-Gracia, Eric Cadalen:
Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength. Microelectron. Reliab. 52(9-10): 2278-2282 (2012) - [j17]Jean-Baptiste Jullien, Bernard Plano, Hélène Frémont:
Pushing toward the limits of acceleration: Example on wire-bond assemblies. Microelectron. Reliab. 52(9-10): 2306-2309 (2012) - [j16]Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont:
Electro- and thermo-migration induced failure mechanisms in Package on Package. Microelectron. Reliab. 52(12): 2889-2906 (2012) - [j15]Hélène Frémont, Geneviève Duchamp, Alexandrine Guédon-Gracia, Frédéric Verdier:
A methodological approach for predictive reliability: Practical case studies. Microelectron. Reliab. 52(12): 3035-3042 (2012) - [c2]Olivier Bonnaud, Hélène Frémont, Jean-Marc Thiriet, Hamed Yahoui:
PhD in Electrical and Information Engineering in Europe: Towards a harmonization including LifeLong Learning. ITHET 2012: 1-5 - [c1]Jean-Marc Thiriet, Hamed Yahoui, Hélène Frémont:
International dimension to increase Lifelong Learning possibilities in Europe. ITHET 2012: 1-5 - 2011
- [j14]A. Aubert, Sébastien Jacques, S. Pétremont, Nathalie Labat, Hélène Frémont:
Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow. Microelectron. Reliab. 51(9-11): 1845-1849 (2011) - [j13]Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont:
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps. Microelectron. Reliab. 51(9-11): 1860-1864 (2011) - 2010
- [j12]Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont:
A fast moisture sensitivity level qualification method. Microelectron. Reliab. 50(9-11): 1654-1660 (2010) - [j11]A. Aubert, J. P. Rebrasse, Lionel Dantas de Morais, Nathalie Labat, Hélène Frémont:
Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing. Microelectron. Reliab. 50(9-11): 1688-1691 (2010) - [j10]Pascal Lecuyer, Hélène Frémont, Jean-Pierre Landesman, Manoubi Auguste Bahi:
Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications. Microelectron. Reliab. 50(9-11): 1744-1749 (2010)
2000 – 2009
- 2009
- [j9]Charles Regard, Christian Gautier, Hélène Frémont, Patrick Poirier, Xiaosong Ma, Kaspar M. B. Jansen:
Fast reliability qualification of SiP products. Microelectron. Reliab. 49(9-11): 958-962 (2009) - [j8]Maxime Berthou, P. Retailleau, Hélène Frémont, Alexandrine Guédon-Gracia, C. Jéphos-Davennel:
Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage. Microelectron. Reliab. 49(9-11): 1267-1272 (2009) - [j7]Manoubi Auguste Bahi, Hélène Frémont, Jean-Pierre Landesman, Annabelle Gentil, Pascal Lecuyer:
A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages. Microelectron. Reliab. 49(9-11): 1273-1277 (2009) - 2007
- [j6]Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont:
Dynamic void formation in a DD-copper-structure with different metallization geometry. Microelectron. Reliab. 47(2-3): 319-325 (2007) - [j5]W. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto:
Torsion test applied for reballing and solder paste volume evaluation. Microelectron. Reliab. 47(9-11): 1663-1667 (2007) - [j4]Manoubi Auguste Bahi, Pascal Lecuyer, Hélène Frémont, Jean-Pierre Landesman:
Sequential environmental stresses tests qualification for automotive components. Microelectron. Reliab. 47(9-11): 1680-1684 (2007) - 2006
- [j3]W. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto:
Improved physical understanding of intermittent failure in continuous monitoring method. Microelectron. Reliab. 46(9-11): 1886-1891 (2006) - 2005
- [j2]Kirsten Weide-Zaage, Walter Horaud, Hélène Frémont:
Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations. Microelectron. Reliab. 45(9-11): 1662-1667 (2005) - 2004
- [j1]Hélène Frémont, Jean-Yves Delétage, Kirsten Weide-Zaage, Yves Danto:
How to study delamination in plastic encapsulated devices. Microelectron. Reliab. 44(9-11): 1311-1316 (2004)
Coauthor Index
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last updated on 2024-10-07 21:15 CEST by the dblp team
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