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Bart Swinnen
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2010 – 2019
- 2012
- [c6]Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne
, Bart Swinnen:
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT 2012: 1-4 - 2011
- [c5]Sandip Halder
, Ingrid De Wolf, Alain Phommahaxay, Andy Miller, Mireille Maenhoudt, Gerald Beyer, Bart Swinnen, Eric Beyne
:
In-line metrology and inspection for process control during 3D stacking of IC's. 3DIC 2011: 1-4 - [c4]Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, Eric Beyne
:
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. 3DIC 2011: 1-4 - 2010
- [c3]Anne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne
, Youssef Travaly, Bart Swinnen:
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications. 3DIC 2010: 1-4
2000 – 2009
- 2009
- [j3]Paul Marchal, Bruno Bougard, Guruprasad Katti, Michele Stucchi, Wim Dehaene, Antonis Papanikolaou, Diederik Verkest, Bart Swinnen, Eric Beyne
:
3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot. Proc. IEEE 97(1): 96-107 (2009) - [c2]Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Michal Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne
, Bart Swinnen:
3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). 3DIC 2009: 1-5 - [c1]Dimitrios Velenis, Michele Stucchi, Erik Jan Marinissen
, Bart Swinnen, Eric Beyne
:
Impact of 3D design choices on manufacturing cost. 3DIC 2009: 1-5 - 2008
- [j2]Yu Yang, Hugo Bender, Kai Arstila
, Bart Swinnen, Bert Verlinden, Ingrid De Wolf:
Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures. Microelectron. Reliab. 48(8-9): 1517-1520 (2008) - 2006
- [j1]Petar Ratchev, Serguei Stoukatch
, Bart Swinnen:
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads. Microelectron. Reliab. 46(8): 1315-1325 (2006)
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